Semiconductor process

• These are supplied in dust type

  wafer test
• wafers should be divided into individual dice

  wafer mounting
• aids in mounting wafer in a metal frame

  adhesive film (fiber)
• Cut using saw blades

  Dicing
• Is used to cool and remove the silicon dust

  deionized water
• imaging system and any positioning errors are corrected

  die bonding (substrate)
• Printed circuit board

  lead frame
• dice are now bonded onto the lead frames

  die bonding (controller, flash memory)
• removing any organic contamination on the surface of the dice

  plasma cleaning
• the aluminum contact surface on the dice and the fingers of the copper lead frame achieved through a thin gold wire

  wire bonding
• Mechanical pull test

  Quality control
• to protect the wire connection from mechanical damage and to prevent the silicon dice from corroding molded with a plastic compound under pressure

  molding
• shadow image is seen

  xray control
• the dambar cuts the copper lead frame via stamping process

  dambar cutting
• ensures that the finished components can be further processed by the customer without problems

  electroplating
• trimmed to the right length and given their first shape after

  trim and form
• this is the full check

  final test
• marked with a laser beam type, date of manufacture and batch number

  Finishing(marking, scanning, tape & reel)
• Thin slice of semiconductor substance used in electronics for the making of integrated circuits

  wafer
• to attach to cables and mount microprocessors allowing for rapid and reliable transmission

  gold wire
• boosts the microprocessor speed

  copper wire
• packaging of electronic components

  tape & reel
• Steps in front line assembly:

  • slicing silicon crystal
  • polishing wafer
  • layer of silicon dioxide (oxidation)
  • photolithography
  • etching
  • layer of silicon dioxide
  • doping
  • electroplating
  • packaging