PHYSMET

Cards (119)

  • Crystal imperfections
    Defects in the regular geometrical arrangement of the atoms in a crystalline solid
  • Perfect crystal
    • An idealization, there is no such thing in nature
  • Defects
    • May be the results of crystal deformation, rapid cooling from high temperature, or high energy radiation striking the solid
  • Defects
    • Influence the mechanical, electrical, and optical behavior of the crystal
  • Types of crystal imperfections
    • Point defects
    • Line defects
    • Surface defects
    • Volume defects
  • Point defects
    Lattice errors at isolated points, due to imperfect packing of atoms during crystallization or vibrations of atoms at high temperatures
  • Equilibrium concentration of point defects
    n = N * exp(-Ed/kbT), where n is number of defects, N is number of atomic sites per mole, Ed is free energy required to form defects, kb is Boltzmann's constant, and T is absolute temperature
  • Vacancies
    Simplest point defect, missing atom or vacant atomic site
  • Frenkel defect
    Cation leaving its normal position and moving into an interstitial site
  • Schottky defect
    Removing one cation and one anion from the interior of the crystal and placing them both at an external surface
  • Compositional defects
    Impurity atoms during crystallization, occurring as substitutional or interstitial impurities
  • Electronic defects
    Errors in charge distribution in solids, necessary for electrical conductivity and related phenomena
  • Line imperfections/dislocations
    1. D defects around which some of the atoms are misaligned, responsible for ductility in materials
  • Edge dislocations
    Vertical plane in the crystal doesn't extend from top to bottom, causing compression above and tension below the slip plane
  • Screw dislocations
    Formed by shear stress, upper region of crystal shifted one atomic distance relative to bottom portion
  • Burgers vector

    Magnitude and direction of lattice distortion associated with a dislocation, perpendicular to dislocation line in edge dislocations and parallel in screw dislocations
  • Surface imperfections
    1. D defects arising from a change in the stacking of atomic planes on or across a boundary
  • External surface imperfections
    Boundary where bonds do not extend beyond, surface atoms have higher energy
  • Internal surface imperfections
    Grain boundaries, tilt boundaries, twin boundaries, stacking faults
  • Grain boundaries
    Separate crystals/grains of different orientation in a polycrystalline material, region of imperfect atomic packing
  • High angle grain boundaries

    Orientation difference between neighboring grains is more than 10-15 degrees
  • Interfaces
    Boundary between 2 crystals with different crystalline arrangements or compositions
  • Tilt boundaries
    Low angle boundary with orientation difference less than 10 degrees, composed of edge dislocations
  • Twin boundaries
    Atomic arrangement on one side is a mirror reflection of the other side, occur in pairs
  • Stacking defects
    Fault arising from stacking one atomic plane out of sequence on another, while the lattice on either side is perfect
  • Volume imperfections
    1. D imperfections like cracks or large vacancies/voids where clusters of atoms are missing
  • Technically important properties like mechanical strength, ductility, crystal growth, magnetic hysteresis, dielectric strength, and semiconductor conduction are greatly affected by crystal imperfections
  • Diffusion
    The process by which atoms move in a material. Many reactions in solids and liquids are diffusion dependent.
  • Diffusion in solids
    • Atoms are not fixed at their position but constantly move (oscillate)
    • Diffusion is difficult in solids due to bonding and requires time, external energy to mobilize the atoms
  • Diffusion couple
    • Joining bars of two different metals together so that there is intimate contact between the two faces, then heating and cooling to observe interdiffusion
  • Interdiffusion
    The process whereby atoms of one metal diffuse into another
  • Self-diffusion
    Atoms within one material exchanging positions
  • Diffusion mechanisms
    1. Vacancy diffusion
    2. Interstitial diffusion
  • Vacancy diffusion
    • Involves the interchange of an atom from a normal lattice position to an adjacent vacant lattice site or vacancy
    • Diffusing atoms and vacancies exchange positions, so diffusion of atoms in one direction corresponds to motion of vacancies in the opposite direction
  • Interstitial diffusion
    • Atoms migrate from an interstitial position to a neighboring one that is empty
    • Found for interdiffusion of impurities like hydrogen, carbon, nitrogen, and oxygen which have atoms small enough to fit into interstitial positions
    • Host or substitutional impurity atoms rarely form interstitials and do not normally diffuse via this mechanism
  • Interstitial diffusion occurs much more rapidly than diffusion by the vacancy mode, since the interstitial atoms are smaller and more mobile
  • There are more empty interstitial positions than vacancies, so the probability of interstitial atomic movement is greater than for vacancy diffusion
  • Factors that influence diffusion
    • Diffusion mechanism (substitutional vs interstitial)
    • Temperature
    • Type of crystal structure of the host lattice
    • Type of crystal imperfections (diffusion faster along grain boundaries and dislocation lines)
    • Excess vacancies
    • Concentration of diffusing species
  • Steady-state diffusion

    Diffusion that takes place at a constant rate, where the number of moles of particles crossing a given interface is constant with time
  • Unsteady-state (non-steady state) diffusion
    Diffusion where the rate is a function of time, so the rate of change of concentration with distance varies with time