Hardware and Mobile Devices

Cards (23)

  • Motherboard
    • For connecting all components
    • Form factors: ATX, microATX, and ITX
    • Types of expansion buses: PCI Express (PCIe) and PCI
    • Intel chipsets link to CPU via DMI or QPI
    • AMD CPU-to-chipset connection is HyperTransport
  • Central processing unit (CPU)

    • Handles most calculations
    • Each core contains L1/L2 cache
    • The entire CPU shares L3 cache
    • Intel CPUs use these sockets: LGA775, 1150, 1155, 1156, 1366, 2011
    • AMD CPUs use these sockets: AM3, AM3+, FM1, FM2, FM2
  • Random Access Memory (RAM)
    • RAM DIMMs include DDR (184 pins), DDR2 (240 pins), DDR3 (240 pins) and DDR4 (288 pins)
    • RAM SODIMMs include DDR (200 pin), DDR2 (200 pin), DDR3 (204 pin), and DDR4 (260 pin)
    • Dual-channel: 2× width of 128-bit bus
    • Triple-channel: 3× width of 192-bit bus
    • Quad-channel: 4× width of 256-bit bus
    • Latency measured as CL or CAS
  • Serial Advanced Technology Attachment (SATA)

    • Consists of a 15-pin power connection and a 7-pin data connector
    • Revisions: Rev 1 (1.5 Gb/s), Rev 2 (3 Gb/s), Rev 3 (6 Gb/s), Rev 3.2 (SATA Express) (16 Gb/s), Rev 3.2 (SATA Express) (16 Gb/s)
    • mSATA = mini-SATA
  • Hard disk drive (HDD)

    • Speeds: 5,400 RPM, 7,200 RPM, 10,000 RPM, 15,000 RPM
    • Form factors: 3.5", 2.5"
  • Solid-state drive (SSD)

    • Communication interfaces: Non-Volatile Memory Express (NVMe), SATA, Peripheral Component Interconnect Express (PCIe): x1, x2, x8, x16
    • Form factors: M.2, mSATA
  • Solid-state media

    • Examples: SSDs, USB flash drives, CompactFlash, Secure Digital (SD) cards
  • Redundant Array of Independent/Inexpensive Disks (RAID)

    • RAID 0 = striping; not fault-tolerant
    • RAID 1 = mirroring. RAID 1 + two disk controllers = disk duplexing
    • RAID 5 = striping with parity
    • RAID 10 = mirrored sets in a striped set
  • Small Computer Systems Interface (SCSI)

    • Modern SCSI standards: Serial Attached SCSI (SAS), Internet SCSI IPS
  • In-plane switching (IPS)

    • Possesses wider viewing angle
  • Optical media
    • Optical disc drives use changeable media to store and retrieve data
    • Versions: read-only memory (ROM), write-once (R), rewritable/write-many (RW)
  • Compact Disc (CD)

    • Capacity: 650–700 MB
  • Digital video/versatile disc (DVD)

    • Special formats: DL: dual-layered, DS: double-sided
    • Capacity: 4.3717 GB
    • Recording technologies: DVD+R, DVD-R, DVD+RW, and DVD-RW
  • Blu-ray disc (BD)

    • For games and HD movies
    • Capacity: 25–128 GB(Mini-disc capacity: 7.8 or 15.6 GB)
  • Laptop
    • Portable miniaturized versions of desktop computers
    • Uses M.2, Mini PCIe, and Mini PCI (internal) and ExpressCard /34 and /54 (external)
    • Replaceable components: Keyboards, Touchpads, SODIMM RAM, Screens, Inverters, Batteries, Optical disc drives, Smart card readers, Hard drives (SSD, HDD, or hybrid)
  • Heat sink
    • When installing a heat sink, use thermal paste or pads for filling in gaps and increasing thermal conductivity between CPU and heat sink
    • Liquid-based cooling systems have higher thermal transfer capabilities than air cooling
  • Power supply unit (PSU)
    • To minimize overheating, a "dual-rail" power supply unit (PSU) separates and controls the current in each wire
  • Sound card
    • Links as x1 PCIe (or PCI cards) and will typically have PC 99 color-coded 1/8" mini-jacks for I/O and speakers and optical I/Os known as S/PDIF
  • Video card
    • You link them to motherboards through x16 PCIe or PCI expansion slots
    • Video connector types and cables: DVI, VGA, HDMI, Mini-HDMI, DisplayPort, Mini Display Port, S-Video, Component Video/RGB, Composite
    • Typical color depths: 16-bit, 24-bit, 32-bit
    • Typical resolutions (aspect ratio): 1280×720 (720p, 16:9), 1920×1080 (1080p, 16:9), 1366×786 (16:9), 1680×1050 (WSXGA+, 8:5), 1920×1200 (WUXGA, 8:5), 640×480 (VGA, 4:3)
  • Image processing of laser printing
    1. Processing
    2. Charging
    3. Exposing
    4. Developing
    5. Transferring
    6. Fusing
    7. Cleaning
  • Printer configuration settings
    • Duplexing: printing on both sides
    • Collation: printing many jobs in a row
    • Orientation: portrait/landscape
    • Quality: 600 or 1200 DPI
  • BIOS/UEFI
    • Locates, tests, and initializes components and boots to the hard drive, optical disc, USB flash drive, or network by PXE
    • CMOS stores time/date and passwords
    • A CR2032 lithium battery powers the CMOS
  • BIOS/UEFI configurations
    • Time/date
    • Boot device order
    • Passwords
    • Power management
    • WOL
    • Monitoring
    • Clock and bus speeds
    • Virtualization support (Intel VT or AMD-V)
    • Enable/disable devices
    • Diagnostics
    • Security
    • Intrusion detection