Reactionkinetics is the transportprocesses/reaction steps
Experimentalmethods are for kinetics (oxidation rates) and Characterisation of oxidation products
Kinetics (oxidation rates) are experimented by massgain/change by:
Measuringbefore and afteroxidationmethod.
2. Use thermogravimetricmethod to know continuousrate use thermo-balance with recordsystem
This all corresponds to the amount of O2taken
Characterisation of products ( knowing if good or badoxidation):
Visual: Colour, oxidethickness, smoothness, porosity and brokenscale.
OpticalMicroscopy: crosssection to check thickness of cut, oxidescaler, porosity/crack, microstructure and contact with surfacelayer
SEM, TEM ( highresolution) and AFM
Crystaloxidestructure: XRD,TEM (make film that shows us the electron attractionpattern/crystal structure) - crystallised/ amorphous - can make without crystal.
Thermodynamics of oxidation:
G=H-TS
G<0spontaneous
G>0 does not take place
G=0 equilibrium
EllinghamDiagram is G plotted withT to decide the dissociation of oxygenpartialpressure
Equilibrium constant
k= products/ reactants
G= - R T ln K
G= R T ln PO2
PO2 is where the metal and oxidecoexist/ dissociation pressure of oxide.
If Partial pressure> PO2, oxidationoccurs/ is stable
If Partial pressure< PO2, oxidation does notoccur/ is unstable/ oxide will decompose
Prevention of Oxidation:
Make PO2 (Partial pressure of O2) very low
Using a reductionatmosphere (H2)
O2 partial pressure used as reference point to compare the relative reactivity of metals in the same oxygen atmosphere
Oxidation Kinetics:
Supply of O2 to reactionsurface
Absorption of O2 into the oxidescale
Reaction between metal & O2 into lattice
Transport of reactants through the oxidelayer - OXIDATION RATE IS CONTROLLED BY SLOWEST STEP WHICH IS THIS STEP
Diffusion of selectivemetalions in alloy
Oxidation rate laws:
Linear: Y=KL t + C1 Y=oxide thickness or mass gain unit area. KL=linear rate constant
ParabolicY^2= Kp t + C2 Kp= Parabolic rate constant
Ellingham diagram plotted 1 mole of oxygen to compare the sameO2 partial pressures by using O2partialpressure as the reference point. O2partialpressures are the drivingforce for different reactions.
Effect of temperature on oxidationrate
D=Do exp(-Q/RT)
Kp=Ko exp (-Q/RT)
Kp= parabolic rate constant. Ko= a constant. Q= Activation energy for diffusion
K=Ko exp (-Q/RT)
lnK=lnKo- (Q-RT)
lnK ~ 1/T linear
Slope used to find Q. (-Q/R)
Oxidation of common metals :
Below570
TOPFe2O31%
TOPFe3O44%
MIDDLEFeO95%
Fe
Non-stoichiometric is faster than stoichiometric
FeO is p-typesemiconductor
High mobility of Fe2+ and highE-
High growth rate
porous structure
Oxidation ofAlloys:
-differentG-selectiveoxidation
-differentdiffusionrate- may accelerateselectiveoxidation
-complexoxide may form (spinel)
-Solidsolubility between oxides [(Cr-Fe)2O3]
-O2 may diffuse into alloy resulting in either internal( damagematerial) or external (goodprotective layer)
Protectivity:
1.Pilling Bedworth Ratio (Rp-b)
2.Stress Generation & Relief
Pilling Bedworth Ratio (Rp-b)
Rp-b=(oxide volume/metal volume)
Rp-b < 1 Non protective- oxide cannot cover metal completely
Rp-b>>1Nonprotective- high stress- likely oxide scale-breakdown
Rp-b~1-2Protective Eg. Al, Si, Cr
Stress Generation and Relief
a)Growth STRESS
Pb ratio-volume difference of metal/oxide- thickness increase, stress increase
Crystal mismatch-Epitaxal relations between metal and oxide
Composition change
Formation of new oxide
Influenceof specimen geometry( more stress in corners)
Stress Generation and Relief
b) THERMALSTRESS
different expansion- not always onetemperature
Linear coefficient of expansion of metal NOT=oxide
Mme/Mo >1 tensile (+)
Mme/Mo <1 compressive- good cause close together and not easy tobreakdown
Mme/Mo >>1 tensile (++++)
Relieving Stress:
Plastic deformation of scale ( Steady Oxidation)
Plastic deformation of metal (Steady Oxidation)
Fracture of scale (Breakdown Oxidation) NOT FOR RELIEF
Loss of scale adhesion to metal (Breakdown Oxidation). NOT FOR RELIEF If breakdown is severe, usefullife is before these REE- Reactive element effect - Y, Ce can be used to improveresistance
Materials used at High Temp
Application
1.Energyproduction and use, power stations, turbines
2.Furnaceparts
Temp for common metals
-C and low alloy steels up to 500C
-Febasedalloy - S.S-Cr2O3 formers up to 800C
Ferrite (bcc) - relatively cheap
Martensite (bcc) - goodmechprep
Austenite (fcc) - goodcomb of mech +chem
-Nibasedalloys - up to 1000C
-Ni of Febasedalloys with Al - up to 1200C
Above1200C use ceramics
Effect of Al % on resistance
-Fe/Ni alloys with Al
Compact and dense
Low diffusion rate(growth rate decreases)
More chemically stable than Cr2O3 (composition does not change)
Volatile Cr2O3 forms >1000C
Problem: Al2O3breaks easily (brittle)
high Al%= mechanicalpropertiesdecrease
Why most oxidation reactions are faster at higher temperature:
Oxidation reactions are thermally activated reactions. Higher thermal energy can accelerate mass transfer (diffusion) and other reaction forces
Oxides are more stable at lower temperature as their formation of free energy is more negative